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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics Kim, Youson; Kim, Junmo; kim, chanyoung; Kim, Taehyun; Lee, Chungryeol; Jeong, Kihoon; Jo, Woosung; Yoo, Seunghyup; Kim, Taek-Soo; Choi, Kyung Cheol; Im, Sung Gap, CHEMICAL ENGINEERING JOURNAL, v.431, no.2, 2022-03 | |
| Transparent and flexible hybrid cover window film: Hard coating/substrate all-in-one composite film for reliable foldable display Lee, Yung; Lee, Hyunhwan; Im, Hyeon-Gyun; Jo, Woosung; Choi, Gwang-Mun; Kim, Taek-Soo; Jang, Junho; Bae, Byeong-Soo, COMPOSITES PART B-ENGINEERING, v.247, 2022-12 | |
| Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature Jo, Woosung; Lee, Tae-Ik; Kim, Taek-Soo, MICROELECTRONICS RELIABILITY, v.130, 2022-03 |
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