DSpace at KOASAS: Search

Results 1-2 of 2 (Search time: 0.003 seconds).

NO	Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1	Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06
2	Thermal expansion behavior of thin films expanding freely on water surface Kim, Jae Han; Jang, Kyung-Lim; Ahn, Kwangho; Yoon, Taeshik; Lee, Tae-Ik; Kim, Taek-Soo, SCIENTIFIC REPORTS, v.9, 2019-05

Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)

Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06

Kim, Jae Han; Jang, Kyung-Lim; Ahn, Kwangho; Yoon, Taeshik; Lee, Tae-Ik; Kim, Taek-Soo, SCIENTIFIC REPORTS, v.9, 2019-05

Discover

KOASAS