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Results 21-30 of 207 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| 유연 기판 위 적층 필름의 굽힘 탄성계수 측정 Lee, Tae-Ik; Kim, Choelgyu; Kim, Min Sung; Kim, Taek-Soo, 마이크로전자 및 패키징학회지, v.23, no.3, pp.63 - 67, 2016-09 | |
| Effects of Ag addition on solid-state interfacial reactions between Sn-Ag-Cu solder and Cu substrate Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu, MATERIALS CHARACTERIZATION, v.124, pp.250 - 259, 2017-02 | |
| Comparison of Methods for Determining the Mechanical Properties of Semiconducting Polymer Films for Stretchable Electronics Rodriquez, Daniel; Kim, Jae Han; Root, Samuel E.; Fe, Zhuping; Boufflet, Pierre; Heeney, Martin; Kim, Taek-Soo; Lipomi, Darren J., ACS APPLIED MATERIALS INTERFACES, v.9, no.10, pp.8855 - 8862, 2017-03 | |
| Accelerated Degradation Due to Weakened Adhesion from Li-TFSI Additives in Perovskite Solar Cells Lee, Inhwa; Yun, Jae Hoon; Son, Hae Jung; Kim, Taek-Soo, ACS APPLIED MATERIALS INTERFACES, v.9, no.8, pp.7029 - 7035, 2017-03 | |
| A high aspect ratio serpentine structure for use as a strain-insensitive, stretchable transparent conductor Jang, Sungwoo; Kim, Cheolgyu; Park, Jung Jin; Jin, Ming Liang; Kim, Seon Joon; Park, O Ok; Kim, Taek-Soo; Jung, Hee-Tae, SMALL, v.14, no.8, 2018-02 | |
| Understanding mechanical behavior and reliability of organic electronic materials Kim, Jae Han; Lee, Inhwa; Kim, Taek-Soo; Rolston, Nicholas; Watson, Brian L.; Dauskardt, Reinhold H., MRS BULLETIN, v.42, no.2, pp.115 - 123, 2017-02 | |
| Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03 | |
| Comparison of Methods for Determining the Mechanical Properties of Semiconducting Polymer Films for Stretchable Electronics Rodriquez, Daniel; Kim, Jae Han; Root, Samuel E.; Fe, Zhuping; Boufflet, Pierre; Heeney, Martin; Kim, Taek-Soo; Lipomi, Darren J., ACS APPLIED MATERIALS INTERFACES, v.9, no.10, pp.8855 - 8862, 2017-03 | |
| Accelerated Degradation Due to Weakened Adhesion from Li-TFSI Additives in Perovskite Solar Cells Lee, Inhwa; Yun, Jae Hoon; Son, Hae Jung; Kim, Taek-Soo, ACS APPLIED MATERIALS INTERFACES, v.9, no.8, pp.7029 - 7035, 2017-03 | |
| Contact-free thermal expansion measurement of very soft elastomers using digital image correlation Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMER TESTING, v.51, pp.181 - 189, 2016-05 |
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