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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| 유연 기판 위 적층 필름의 굽힘 탄성계수 측정 Lee, Tae-Ik; Kim, Choelgyu; Kim, Min Sung; Kim, Taek-Soo, 마이크로전자 및 패키징학회지, v.23, no.3, pp.63 - 67, 2016-09 | |
| Contact-free thermal expansion measurement of very soft elastomers using digital image correlation Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMER TESTING, v.51, pp.181 - 189, 2016-05 | |
| Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations Pyo, Jae-Bum; Lee, Tae-Ik; Kim, Cheolgyu; Kim, Min Sung; Kim, Taek-Soo, SOFT MATTER, v.12, no.18, pp.4135 - 4141, 2016-03 | |
| Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly Kim, Tae-Wan; Lee, Tae-Ik; Pan, Yan; Kim, Wansun; Zhang, Shuye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.9, 2016-09 | |
| Extremely Robust and Patternable Electrodes for Copy-Paper-Based Electronics Ahn, Jaeho; Seo, Ji Won; Lee, Tae-Ik; Kwon, Donguk; Park, Inkyu; Kim, Taek-Soo; Lee, Jung-Yong, ACS APPLIED MATERIALS & INTERFACES, v.8, no.29, pp.19031 - 19037, 2016-07 | |
| Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, MICROELECTRONICS RELIABILITY, v.73, pp.136 - 145, 2017-06 | |
| Highly Sensitive, Flexible, and Wearable Pressure Sensor Based on a Giant Piezocapacitive Effect of Three-Dimensional Microporous Elastomeric Dielectric Layer Kwon, Donguk; Lee, Tae-Ik; Shim, Jongmin; Ryu, Seunghwa; Kim, Min Seong; Kim, Seunghwan; Kim, Taek-Soo; Park, Inkyu, ACS APPLIED MATERIALS & INTERFACES, v.8, no.26, pp.16922 - 16931, 2016-07 | |
| Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package Kim, Young-Lyong; Lee, Tae-Ik; Kim, Ji-Hye; Kim, Wonsik; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.200 - 207, 2016-02 | |
| Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications Kim, Ji-Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.208 - 215, 2016-02 | |
| The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications Kim, Ji-Hye; Lee, Tae-Ik; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.10, pp.1583 - 1591, 2017-10 |
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