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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Tailoring UV cure depth profiles for optimal mechanical properties of organosilicate thin films Kim, Taek-Soo; Chumakov, Dmytro; Zschech, Ehrenfried; Dauskardt, Reinhold H., APPLIED PHYSICS LETTERS, v.95, no.7, 2009-08 | |
| Depth dependence of ultraviolet curing of organosilicate low-k thin films Kim, Taek-Soo; Tsuji, Naoto; Kemeling, Nathan; Matsushita, Kiyohiro; Geisler, Holm; Zschech, Ehrenfried; Dauskardt, Reinhold H., JOURNAL OF APPLIED PHYSICS, v.103, no.6, 2008-03 | |
| Superstrong encapsulated monolayer graphene by the modified anodic bonding Jung, Won Suk; Yoon, Taeshik; Choi, Jongho; Kim, Soohyun; Kim, Yong Hyup; Kim, Taek-Soo; Han, Chang-Soo, NANOSCALE, v.6, no.1, pp.547 - 554, 2014-01 |