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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 | |
Thermal expansion behavior of thin films expanding freely on water surface Kim, Jae Han; Jang, Kyung-Lim; Ahn, Kwangho; Yoon, Taeshik; Lee, Tae-Ik; Kim, Taek-Soo, SCIENTIFIC REPORTS, v.9, 2019-05 |
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