Browse "ME-Journal Papers(저널논문)" by Author Paik, KW

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Effects of Solder Alloys on Reliability of Low Cost Flip Chip Solder Joints using Electroless Ni-P UBMs

Jeon, Young Doo; Yang, Se Young; Paik, KW; Lee, Soon-Bok, IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006-12

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