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Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jang, J.-W.; Suk, K.-L.; Paik, K.-W.; Lee, Soon-Bok, PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, v.7522, no.0, pp.0 - 0, 2010 |
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