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1
3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage

Jo, Mansik; Bae, Seunghwan; Oh, Injong; Jeong, Ji-hun; Kang, Byoungsoo; Hwang, Seok Joon; Lee, Seung-Seob; et al, ACS NANO, v.13, no.11, pp.12500 - 12510, 2019-11

2
Combinatorial experiments for discovering Al-C thin films with high strength and ductility

Oh, Injong; Kim, Hojang; Son, Hansol; Nam, Seungjin; Choi, Hyunjoo; Sim, Gi-Dong, INTERNATIONAL JOURNAL OF PLASTICITY, v.161, 2023-02

3
High-throughput membrane deflection characterization of shape memory alloy thin films

Lee, Zhuo Feng; Ryu, Hyemin; Kim, Ji-Young; Kim, Hojang; Choi, Jae-Hoon; Oh, Injong; Sim, Gi-Dong, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.892, 2024-02

4
Sputter-deposited Ni-rich NiTi thin films: Mechanical behavior and composition sensitivity

Kim, Ji-Young; Rehman, Abdul; Ryu, Hyemin; Oh, Injong; Sim, Gi-Dong, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.912, 2024-10

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