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Improvement in Thermomechanical Reliability of Power Conversion Modules Using SiC Power Semiconductors: A Comparison of SiC and Si via FEM Simulation 김철규; 오철민; 최윤화; 장경운; 김택수, 마이크로전자 및 패키징학회지, v.25, no.3, pp.21 - 30, 2018-09 |
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