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Browse "ME-Journal Papers(저널논문)" by Subject wafer level

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1	Novel Sidewall Interconnection Using a Perpendicular Circuit Die for 3-D Chip Stacking Kim, Sun-Rak; Lee, Jae Hak; Lee, Seung-Seob, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.9, pp.1265 - 1272, 2015-09

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