Browse "ME-Journal Papers(저널논문)" by Subject lead free solder

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A comparative study of the fatigue Behavior of SnAgCu and SnPb solder joints

Kim, IH; Park, TS; Yang, SY; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, v.297-300, pp.831 - 836, 2005

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