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Browse "ME-Journal Papers(저널논문)" by Subject inclined conductive bump (ICB)

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1	Development of Inclined Conductive Bump for Flip-Chip Interconnection Park, Ah-Young; Park, Seungbae; Yoo, Choong-Don, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.2, pp.207 - 216, 2015-02

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