DSpace at KOASAS
Browsing DSpace

Browse "ME-Journal Papers(저널논문)" by Subject cure shrinkage

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 1 of 1

1
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles

Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.8, pp.11024 - 11032, 2023-01

Discover

Type

Open Access

Date issued

. next

Subject

. next

rss_1.0 rss_2.0 atom_1.0