Browse "ME-Journal Papers(저널논문)" by Subject creep
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| Fatigue and fracture assessment for reliability in electronics packaging Lee, Soon-Bok; Kim, I; Park, TS, INTERNATIONAL JOURNAL OF FRACTURE, v.150, pp.91 - 104, 2008-03 |
| Modified-creep experiment of an elastomer film on a rigid substrate using nanoindentation with a flat-ended cylindrical tip Choi, Seung Tae; Jeong, Su Jeong; Earmme, Youn-Young, SCRIPTA MATERIALIA, v.58, no.3, pp.199 - 202, 2008-02 |
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