Browse "ME-Journal Papers(저널논문)" by Subject copper
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| A study of the hydrostatic extrusion of copper-clad aluminium tube Park, HJ; Na, KH; Cho, NS; Lee, YS; Kim, Seung-Woo, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.67, no.1-3, pp.24 - 28, 1997-05 |
| Cellular Automata Modeling of Grain Coarsening and Refinement during the Dynamic Recrystallization of Pure Copper Lee, Ho Won; Im, Yong-Taek, MATERIALS TRANSACTIONS, v.51, no.9, pp.1614 - 1620, 2010-09 |
| Residual stress-driven test technique for freestanding ultrathin films: Elastic behavior and residual strain Cuddalorepatta, Gayatri K.; Sim, Gi-Dong; Li, Han; Pantuso, Daniel; Vlassak, Joost J., JOURNAL OF MATERIALS RESEARCH, v.34, no.20, pp.3474 - 3482, 2019-10 |
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