Browse "ME-Journal Papers(저널논문)" by Subject ball grid array (BGA)
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| Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.2, pp.478 - 484, 2008-06 |
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