Browse "ME-Journal Papers(저널논문)" by Subject LEAD-FREE SOLDERS
Showing results 1 to 3 of 3
| Effects of Ag addition on solid-state interfacial reactions between Sn-Ag-Cu solder and Cu substrate Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu, MATERIALS CHARACTERIZATION, v.124, pp.250 - 259, 2017-02 |
| Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints Lee, K. O.; Yu, Jin; Park, T. S.; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF FATIGUE, v.48, pp.1 - 8, 2013-03 |
| Low-cycle fatigue characteristics of Sn-based solder joints Lee, KO; Yu, Jin; Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.4, pp.249 - 257, 2004-04 |
Discover
Type
- 12,193 Article
Open Access
- 407 OA Article
Date issued
- 1,611 2020 - 2024
- 3,971 2010 - 2019
- 3,679 2000 - 2009
- 2,269 1990 - 1999
- 600 1980 - 1989