Browse "ME-Journal Papers(저널논문)" by Subject COPPER CMP
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Pad Scratching in Chemical-Mechanical Polishing: The Effects of Mechanical and Tribological Properties Kim, Sanha; Saka, Nannaji; Chun, Jung-Hoon, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v.3, no.5, pp.P169 - P178, 2014-04 |
| Scratching of Patterned Cu/Dielectric Surface Layers by Pad Asperities in CMP Kim, Sanha; Saka, Nannaji; Chun, Jung-Hoon, IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, v.28, no.1, pp.96 - 105, 2015-02 |
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