Browse "ME-Journal Papers(저널논문)" by Author Park, Seong Yeon
Showing results 1 to 8 of 8
| Design of periodic arched structures integrating the structural nonlinearity and band gap effect for vibration isolation On, Seung Yoon; Moon, Hyemi; Park, Seong Yeon; Ohm, Tae Woong; Kim, Wonvin; Kim, Seong Su, MATERIALS & DESIGN, v.224, 2022-12 |
| Effects of Microwave-Assisted Cross-Linking on the Creep Resistance and Sensing Accuracy of a Coaxial-Structured Fiber Strain Sensor On, Seung Yoon; Park, Seong Yeon; Chung, Yong Sik; Kim, Seong Su, ADVANCED MATERIALS TECHNOLOGIES, v.8, no.6, 2023-03 |
| Effects of process-induced residual stress and geometric characteristics on pressure-resisting capability of corrugation in primary barriers of liquefied natural gas carriers Park, Seong Yeon; Kim, Woe Tae; Choi, Jae Hoon; On, Seung Yoon; Kim, Seong Su, OCEAN ENGINEERING, v.237, 2021-10 |
| Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.8, pp.11024 - 11032, 2023-01 |
| Hierarchically Porous Carbon Nanofibers with Controllable Porosity Derived from Iodinated Polyvinyl Alcohol for Supercapacitors Seok, Jae Young; Song, Seung A.; Yang, Inyeong; Woo, Kyoohee; Park, Seong Yeon; Park, Jung Hwan; Kim, Sanha; et al, ADVANCED MATERIALS INTERFACES, v.7, no.16, pp.2000513, 2020-08 |
| Optimum boundaries for maximum load-carrying capacity in water-lubricated composite journal bearings incorporating turbulences and inertial effects based on elastohydrodynamic analysis Kim, Wonvin; Lim, Suhyun; Hong, Hyunsoo; Jeong, Kwang Il; On, Seung Yoon; Park, Seong Yeon; You, Jun Il; et al, JOURNAL OF COMPUTATIONAL DESIGN AND ENGINEERING, v.9, no.6, pp.2506 - 2523, 2022-11 |
| Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.32, pp.38750 - 38758, 2023-08 |
| 초박형 반도체 패키지의 EMC encapsulation을 위한 경화 공정 개발 Park, Seong Yeon; On, Seung Yoon; Kim, Seong Su, COMPOSITES RESEARCH, v.34, no.1, pp.47 - 50, 2021-02 |
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