Browse "ME-Journal Papers(저널논문)" by Author Lee, Jihye
Showing results 1 to 7 of 7
| Deep Learning Enhances Multiparametric Dynamic Volumetric Photoacoustic Computed Tomography In Vivo (DL-PACT) Choi, Seongwook; Yang, Jinge; Lee, Soo Young; Kim, Jiwoong; Lee, Jihye; Kim, Won Jong; Lee, Seungchul; et al, ADVANCED SCIENCE, v.10, no.1, 2023-01 |
| Direct micro/nano metal patterning based on two-step transfer printing of ionic metal nano-ink Kim, Sanghyeok; Lee, Won Seok; Lee, Jihye; Park, Inkyu, NANOTECHNOLOGY, v.23, no.28, 2012-07 |
| Fabrication of a flip chip solder bump using a thin mold and ultrasonic filling Nam, Dong Jin; Lee, Jae Hak; Lee, Jihye; Yoo, Choong Don, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.17, no.9, pp.1863 - 1869, 2007-09 |
| Interior-architectured ZnO nanostructure for enhanced electrical conductivity via stepwise fabrication process Chong, Eugene; Kim, Sarah; Choi, Jun-Hyuk; Choi, Dae-Geun; Jung, Joo-Yun; Jeong, Jun-Ho; Lee, Eung-sug; et al, NANOSCALE RESEARCH LETTERS, v.9, 2014-08 |
| Room-Temperature Compressive Transfer Printing of Nanowires for Nanoelectronic Devices Lee, Won Seok; Choi, Jun-hyeok; Park, Inkyu; Lee, Jihye, LANGMUIR, v.28, no.51, pp.17851 - 17858, 2012-12 |
| Thermo-compressive transfer printing for facile alignment and robust device integration of nanowires Lee, Won Seok; Won, Sejeong; Park, Jeunghee; Lee, Jihye; Park, Inkyu, NANOSCALE, v.4, no.11, pp.3444 - 3449, 2012-03 |
| Thermosonic soldering of cross-aligned strip solder bumps for easy alignment and low-temperature bonding Lee, Jihye; Yoo, Choong D., JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.18, no.12, 2008 |
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