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Micro heat flux sensor using copper electroplating in SU-8 microstructures Oh, SH; Lee, KC; Chun, J; Kim, M; Lee, Seung Seob, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.11, no.3, pp.221 - 225, 2001-05 |
Non-colloidal sedimentation compared with Kynch theory Chang, Daejun; Lee, Tai-Yong; Jang, Y; Kim, M; Lee, Soonchil, POWDER TECHNOLOGY, v.92, no.1, pp.81 - 87, 1997-06 |
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