Browse "ME-Journal Papers(저널논문)" by Author Earmme, Youn-Young
Showing results 54 to 59 of 59
| Strength design and minimization of residual stresses in reversible GaAs wafer bonding process Choi, ST; Song, JY; Kim, JH; Lee, S; Earmme, Youn-Young, KEY ENGINEERING MATERIALS, v.306-308, pp.1337 - 1342, 2006-03 |
| The Elastic Field of an Elliptical Cylindrical Inclusion in a Laminated with Multiple Isotropic Layers h.g. beom; Earmme, Youn-Young, JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, v.66, no.1, pp.165 - 171, 1999-03 |
| Thermoelastic analysis of circular arc-shaped cracks Chung, HD; Beom, HG; Choi, SY; Earmme, Youn-Young, JOURNAL OF THERMAL STRESSES, v.21, no.2, pp.129 - 140, 1998-03 |
| Thermomechanical stress analysis of laminated thick-film multilayer substrates Kim, JS; Paik, Kyung-Wook; Lim, JH; Earmme, Youn-Young, APPLIED PHYSICS LETTERS, v.74, no.23, pp.3507 - 3509, 1999-06 |
| Time-dependent adhesion of a polydimethylsiloxane (PDMS) elastomer film to a flat indenter tip characterized using a cohesive-zone law Mai, Nghia Trong; Choi, Seung Tae; Chung, Koo-Hyun; Lee, Seung Ryoon; Shin, Dong Kil; Earmme, Youn-Young, PHILOSOPHICAL MAGAZINE LETTERS, v.94, no.4, pp.242 - 250, 2014-04 |
| Useful Conservation Sums in Molecular Dynamics and Atomistics Kim, Saeja O.; Earmme, Youn-Young; Kim, Kyung-Suk, MATHEMATICS AND MECHANICS OF SOLIDS, v.15, no.8, pp.885 - 895, 2010 |
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