Browse "ME-Journal Papers(저널논문)" by Subject cure cycle

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Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements

Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.32, pp.38750 - 38758, 2023-08

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