Showing results 4 to 6 of 6
Low-cycle fatigue characteristics of Sn-based solder joints Lee, KO; Yu, Jin; Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.4, pp.249 - 257, 2004-04 |
Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.2, pp.478 - 484, 2008-06 |
Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding Lee, JY; Kim, JH; Yoo, Choong-Don, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.1, pp.96 - 102, 2005-01 |
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