Browse "ME-Journal Papers(저널논문)" by Subject lead-free solder
Showing results 4 to 6 of 6
| Low-cycle fatigue characteristics of Sn-based solder joints Lee, KO; Yu, Jin; Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.4, pp.249 - 257, 2004-04 |
| Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.2, pp.478 - 484, 2008-06 |
| Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding Lee, JY; Kim, JH; Yoo, Choong-Don, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.1, pp.96 - 102, 2005-01 |
Discover
Type
- 12,156 Article
Open Access
- 407 OA Article
Date issued
- 1,580 2020 - 2024
- 3,965 2010 - 2019
- 3,679 2000 - 2009
- 2,269 1990 - 1999
- 600 1980 - 1989