Browse "ME-Journal Papers(저널논문)" by Subject Wires
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| Quantification of Performance Variation and Crack Evolution of Bond-Wire Interconnects Under Harsh Temperature Environments by S-Parameter Analysis Kang, Tae Yeob; Seo, Donghwan; Min, Joonki; Kim, Taek-Soo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.6, pp.990 - 998, 2021-06 |
| Strong Continuum Manipulator for Flexible Endoscopic Surgery Hwang, Minho; Kwon, Dong-Soo, IEEE-ASME TRANSACTIONS ON MECHATRONICS, v.24, no.5, pp.2193 - 2203, 2019-10 |
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