Browse "ME-Journal Papers(저널논문)" by Author Ha, Chang-Wan
Showing results 4 to 6 of 6
| Elastic region of an ACF joint for thermosonic flip-chip bonding Ha, Chang-Wan; Jang, Tae-Young; Kim, Kyung-Rok; Yun, Won-Soo; Kim, Kyung-Soo, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.21, no.9, 2011-09 |
| Robust Zero Placement for Motion Control of Lightly Damped Systems Ha, Chang-Wan; Rew, Keun-Ho; Kim, Kyung-Soo, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.60, no.9, pp.3857 - 3864, 2013-09 |
| Sliding Mechanism of Lateral Thermosonic Process With Anisotropic Conductive Film for High Productivity and High Reliability Ha, Chang-Wan; Kim, Kyung-Rok; Kim, Kyung-Soo; Kim, Soohyun, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.2, pp.205 - 212, 2013-02 |
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