Browse "ME-Journal Papers(저널논문)" by Subject lead-free solder
Showing results 5 to 6 of 6
| Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.2, pp.478 - 484, 2008-06 |
| Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding Lee, JY; Kim, JH; Yoo, Choong-Don, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.1, pp.96 - 102, 2005-01 |
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