Showing results 45 to 59 of 59
Lattice Dynamics Studies of Grain Boundary Structures I. Method and Application to Stability Earmme, Youn-Young; j.k. lee; r.j. harrison; g.h. bishop, SURFACE SCIENCE, v.92, no.1, pp.174 - 184, 1980 |
LATTICE-DYNAMICS STUDIES OF GRAIN-BOUNDARY STRUCTURES .2. THERMODYNAMIC FUNCTIONS Earmme, Youn-Young; LEE, JK; HARRISON, RJ; BISHOP, GH, SURFACE SCIENCE, v.118, no.3, pp.623 - 633, 1982 |
LOSS-FREE DISLOCATION-MOTION IN A LATTICE MODEL Earmme, Youn-Young; WEINER, JH, PHYSICAL REVIEW LETTERS, v.33, no.26, pp.1550 - 1552, 1974 |
Measurement of time-dependent adhesion between a polymer film and a flat indenter tip Choi, S. T.; Lee, S. R.; Earmme, Youn-Young, JOURNAL OF PHYSICS D-APPLIED PHYSICS, v.41, no.7, 2008-04 |
MODELING AND VIBRATION ANALYSIS OF A SIMPLE ROTOR WITH A BREATHING CRACK JUN, OS; EUN, HJ; Earmme, Youn-Young; Lee, Chong-Won, JOURNAL OF SOUND AND VIBRATION, v.155, no.2, pp.273 - 290, 1992-06 |
Modelling and design of an exhaust manifold under thermomechanical loading Park, K. H.; Choi, B. L.; Lee, K. W.; Kim, K. S.; Earmme, Youn-Young, PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART D-JOURNAL OF AUTOMOBILE ENGINEERING, v.220, no.D12, pp.1755 - 1764, 2006-12 |
Modified-creep experiment of an elastomer film on a rigid substrate using nanoindentation with a flat-ended cylindrical tip Choi, Seung Tae; Jeong, Su Jeong; Earmme, Youn-Young, SCRIPTA MATERIALIA, v.58, no.3, pp.199 - 202, 2008-02 |
On the unified approach to anisotropic and isotropic elasticity for singularity, interface and crack in dissimilar media (vol 40, pg 1411, 2003) Choi, S. T.; Shin, H.; Earmme, Youn-Young, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.43, no.21, pp.6665 - 6666, 2006-03 |
PLASTIC RELAXATION OF THE TRANSFORMATION STRAIN-ENERGY OF A MISFITTING SPHERICAL PRECIPITATE - IDEAL PLASTIC BEHAVIOR j.k. lee; Earmme, Youn-Young; h.i. aaronson; k.c. russell, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.11, no.11, pp.1837 - 1847, 1980 |
Strength design and minimization of residual stresses in reversible GaAs wafer bonding process Choi, ST; Song, JY; Kim, JH; Lee, S; Earmme, Youn-Young, KEY ENGINEERING MATERIALS, v.306-308, pp.1337 - 1342, 2006-03 |
The Elastic Field of an Elliptical Cylindrical Inclusion in a Laminated with Multiple Isotropic Layers h.g. beom; Earmme, Youn-Young, JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, v.66, no.1, pp.165 - 171, 1999-03 |
Thermoelastic analysis of circular arc-shaped cracks Chung, HD; Beom, HG; Choi, SY; Earmme, Youn-Young, JOURNAL OF THERMAL STRESSES, v.21, no.2, pp.129 - 140, 1998-03 |
Thermomechanical stress analysis of laminated thick-film multilayer substrates Kim, JS; Paik, Kyung-Wook; Lim, JH; Earmme, Youn-Young, APPLIED PHYSICS LETTERS, v.74, no.23, pp.3507 - 3509, 1999-06 |
Time-dependent adhesion of a polydimethylsiloxane (PDMS) elastomer film to a flat indenter tip characterized using a cohesive-zone law Mai, Nghia Trong; Choi, Seung Tae; Chung, Koo-Hyun; Lee, Seung Ryoon; Shin, Dong Kil; Earmme, Youn-Young, PHILOSOPHICAL MAGAZINE LETTERS, v.94, no.4, pp.242 - 250, 2014-04 |
Useful Conservation Sums in Molecular Dynamics and Atomistics Kim, Saeja O.; Earmme, Youn-Young; Kim, Kyung-Suk, MATHEMATICS AND MECHANICS OF SOLIDS, v.15, no.8, pp.885 - 895, 2010 |
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