Search
Results 1-10 of 183 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Simulation of Fatigue-Creep Damage of Type 304 Stainless Steel at Elevated Temperature Lee, Soon-Bok; Woo, YS; Kim, JY, Fatigue '93, pp.927 - 932, 1993 | |
| Crack Propagation in Plates under Mixed-Mixed-Mode Impact Fatigue Loading Lee, Soon-Bok; Noh, SI, International Symposium on Impact Engineering(ISIE), pp.355 - 360, 1992 | |
| A Study on the Corner Crack Growth at a Hole Using a Laser Interferometry Strain/Displacement Gage Lee, Soon-Bok; Kim, JH, International Session of JSME Spring Conference of JSME, pp.589 - 591, 1994 | |
| Reliability Evaluation of Solder joints in Electronics Packaging Lee, Soon-Bok, Korea-Usa Electronic Packaging Symposium, pp.110 - 129, 2002 | |
| Stress profiles at notches for fatigue strength improvements Lee, Soon-Bok, Asian-Pacific Congress of Strength Evaluation '89, (APCS'89), pp.611 - 616, 1989 | |
| Calculation of Stress Intensity Factor Weight Function Method for a Patched Crack Plate Kim, JH; Suh, DC; Lee, Soon-Bok; Lee Jung Joo, KSME2000 Conference of Materials and Fracture Division, pp.15 - 20, 2000-02 | |
| Application of Comtinum Damage Model to Life Prediction of Geometrically Nonlinear Structure in High Temperature Youn, SS; Lee, Soon-Bok; Kim, JB; Lee, HY; Yoo, B, Korea Society of Atomic Power, 2000-05 | |
| Numerical Simulation of the Formation of Coined Solder Bump Hwang, T.K; Lee, Soon-Bok; Nah, JW; Paik, KW, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.388 - 392, 2001 | |
| A Parametric Study on the Thermal Fatigue Reliability of Flip Chip Solder Joints in Electronic Packaging Kim, JY; Lee, Soon-Bok, 1996 Int. Symposium on Experimental/numerical Mechanics in Electronic Packaging, pp.33 - 34, 1996 | |
| Finite Element Analysis and X-ray Measurement of Residual Stresses of Ceramic/Metal Joints Lee, Soon-Bok; Kim, JH, Int. conf. on Mechanics and Materials Engineering (MSME-95), pp.498 - 503, 1995 |
Discover
Type
- 183 Conference
Date issued
- 23 2010 - 2014
- 125 2000 - 2009
- 29 1990 - 1999
- 6 1984 - 1989