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Die Shear test of the coined solder bumps package with various UBM and solder materials Lee, Soon-Bok; Hwang, TK; Nah, JW; Paik, KW, , 2003 |
Numerical Simulation of the Formation of Coined Solder Bump Hwang, T.K; Lee, Soon-Bok; Nah, JW; Paik, KW, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.388 - 392, 2001 |
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