Browse "ME-Conference Papers(학술회의논문)" by Author Kang J.H.
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| A study on adhesion between mold and in nanoimprint lithography Kim K.-S.; Kang J.H.; Kim, Kyung-Woong, 2005 World Tribology Congress III, pp.767 - 768, 2005-09-12 |
| Effect of process conditions on adhesion between stamp and polymer film used in thermal nanoimprint lithography Kim K.S.; Kang J.H.; Kim, Kyung-Woong, ASME/STLE International Joint Tribology Conference, IJTC 2007, pp.865 - 866, 123, 2007-10-22 |
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