Results 1-10 of 254 (Search time: 0.008 seconds).
NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Flash-Induced Self-Limited Plasmonic Welding of Silver Nanowire Network for Transparent Flexible Energy Harvester Park, Jung Hwan; Hwang, Geon-Tae; Kim, Shin-Ho; Seo, Jeongmin; Park, Hong-Jin; Yu, Kyoungsik; Kim, Taek-Soo; Lee, Keon Jae, ADVANCED MATERIALS, v.29, no.5, 2017-02 | |
Effects of Temperature and Operation Parameters on the Galvanic Corrosion of Cu Coupled to Au in Organic Solderability Preservatives Process Oh, Se-Kwon; Kim, YoungJun; Jung, Ki Min; Kim, Jongsoo; Shon, MinYoung; Kwon, HyukSang, METALS AND MATERIALS INTERNATIONAL, v.23, no.2, pp.290 - 297, 2017-03 | |
Hematite-Based Photoelectrode Materials for Photoelectrocatalytic Inhibition of Alzheimer's beta-Amyloid Self-Assembly Kim, Kayoung; Lee, Byung Il; Chung, You Jung; Choi, Woo Seok; Park, Chan Beum, ADVANCED HEALTHCARE MATERIALS, v.6, no.8, 2017-04 | |
Transparent, thermally stable methyl siloxane hybrid materials using sol-gel synthesized vinyl-methyl oligosiloxane resin Bae, Jun-Young; Jang, Junho; Bae, Byeong-Soo, JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, v.82, no.1, pp.253 - 260, 2017-04 | |
A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-Fine-Pitch Interconnection Applications Lee, Sang Hoon; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.46, no.1, pp.167 - 174, 2017-01 | |
Atomic Layer Etching Mechanism of MoS2 for Nanodevices Kim, Ki Seok; Kim, Ki Hyun; Nam, Yeonsig; Jeon, Jaeho; Yim, Soonmin; Singh, Eric; Lee, Jin Yong; Lee, Sung Joo; Jung, Yeon Sik; Yeom, Geun Young; Kim, Dong Woo, ACS APPLIED MATERIALS & INTERFACES, v.9, no.13, pp.11967 - 11976, 2017-04 | |
Development of fluorescence-conjugated islet-homing peptide using biopanning for targeted optical imaging of pancreatic islet Kim, Min Jun; Yu, Jeong Heon; Oh, Mi Hwa; Nam, Yoon Sung; Lee, Dong Yun, JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, v.45, pp.404 - 411, 2017-01 | |
Electrospun Nb-doped TiO2 nanofiber support for Pt nanoparticles with high electrocatalytic activity and durability Kim, MinJoong; Kwon, ChoRong; Eom, KwangSup; Kim, JiHyun; Cho, Eunae, SCIENTIFIC REPORTS, v.7, 2017 | |
Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08 | |
A study on Flex-on-Fabric (FOF) Interconnection Using Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method Jung, Seung-Yoon; Hong, Hye-Eun; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1265 - 1271, 2017-08 |
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