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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Interfacial microstructure of diffusion-bonded SiC and Re with Ti interlayer Kim, Joo-Hyung; Kim, Dong-Seok; Lim, Seong Taek; Kim, Do Kyung, JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.316 - 320, 2017-04 |