Browse "MS-Journal Papers(저널논문)" by Subject warpage
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| A study on coining processes of solder bumps on organic substrates Nah, JW; Paik, Kyung-Wook; Hwang, TK; Kim, WH, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.26, pp.166 - 172, 2003-04 |
| Effects of thermal cycling on material properties of nonconductive pastes (NCPs) and the relationship between material properties and warpage behavior during thermal cycling Jang, Kyung-Woon; Kim, Hyoung-Joon; Chung, Chang-Kyu; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.3, pp.559 - 565, 2008-09 |
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