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STUDIES ON THE HIGH-TEMPERATURE SUPERCONDUCTOR (HTS)/METAL/POLYMER DIELECTRIC INTERCONNECT STRUCTURE FOR PACKAGING APPLICATIONS

Paik, Kyung-Wook; Mogrocampero, A, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, v.17, no.3, pp.435 - 441, 1994-08

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