Browse "MS-Journal Papers(저널논문)" by Subject Ultrasonic bonding
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| Highly Reliable Solder ACFs FOB (Flex-on-Board) Interconnection Using Ultrasonic Bonding 김유선; Zhang Shuye; 백경욱, 마이크로전자 및 패키징학회지, v.22, no.1, pp.35 - 41, 2015-03 |
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