Browse "MS-Journal Papers(저널논문)" by Subject RAPID FORMATION
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| The In-Situ TEM Isothermal Aging Evolution in a μ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics Liu, Jinhong; Jing, Xinyi; Chen, Jieshi; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, ELECTRONIC MATERIALS LETTERS, v.20, no.3, pp.352 - 361, 2024-05 |
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