Browse "MS-Journal Papers(저널논문)" by Subject Packaging
Showing results 1 to 3 of 3
| A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films Pan, Yan; Oh, Seung-Jin; Kim, Ji-Hye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.6, pp.941 - 948, 2020-06 |
| Comparison of the Power Consumption between the Ceramic and Wire Bonding Packaging Methods for Solid- State Electrochemical Carbon dioxide sensors Kim, Tae Wan; Park, Chong-Ook, 센서학회지, v.25, no.3, pp.173 - 177, 2016-05 |
| Tungsten alloying of the Ni(P) films and the reliability of Sn-3.5Ag/NiWP solder joints Jang, Dong-Min; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.26, no.7, pp.889 - 895, 2011-04 |
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