Browse "MS-Journal Papers(저널논문)" by Subject PACKAGES
Showing results 1 to 6 of 6
| ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics Yoon, Dal-Jin; Malik, Muhammad-Hassan; Yan, Pan; Paik, Kyung-Wook; Roshanghias, Ali, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.32, no.2, pp.2283 - 2292, 2021-01 |
| Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.20, no.8, pp.1931 - 1934, 2005-08 |
| Effects of chemical oxidations on the fracture toughness of leadframe/EMC interfaces Lee, HY; Yu, Jin, METALS AND MATERIALS-KOREA, v.5, no.5, pp.471 - 476, 1999-10 |
| Effects of oxidation treatments on the fracture toughness of leadframe/epoxy interfaces Lee, H.Y.; Yu, Jin, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.277, no.1-2, pp.154 - 160, 2000-01 |
| Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Choi, WK, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.7, pp.790 - 795, 2004-07 |
| Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM Jee, YK; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.10, pp.2286 - 2291, 2010-10 |
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