Browse "MS-Journal Papers(저널논문)" by Subject FAILURE MECHANISMS
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| Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 |
| Effects of Self-Assembled Monolayer and PFPE Lubricant on Wear Characteristics of Flat Silicon Tips Kim, H. J.; Jang, C. E.; Kim, D. E.; Kim, Y. K.; Choa, S. H.; Hong, S., TRIBOLOGY LETTERS, v.34, no.1, pp.61 - 73, 2009-04 |
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