Browse "MS-Journal Papers(저널논문)" by Type Article
Showing results 3781 to 3800 of 7302
| Interfacial microstructure of diffusion-bonded SiC and Re with Ti interlayer Kim, Joo-Hyung; Kim, Dong-Seok; Lim, Seong Taek; Kim, Do Kyung, JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.316 - 320, 2017-04 |
| Interfacial microstructure of diffusion-bonded W-25Re/Ti/graphite joint and its high-temperature stability Kim, Joo-Hyung; Baek, Changyeon; Kim, Dong Seok; Lim, Seong Taek; Kim, Do Kyung, Korean Journal of Materials Research, v.26, no.12, pp.751 - 756, 2016-12 |
| Interfacial perpendicular magnetic anisotropy in CoFeB/MgO structure with various underlayers Oh, Young-Wan; Lee, Kyeong-Dong; Jeong, Jong-Ryul; Park, Byong-Guk, JOURNAL OF APPLIED PHYSICS, v.115, no.17, pp.17C724, 2014-05 |
| Interfacial reaction and control of Pt/PZT/Pt by sol-gel process No, Kwangsoo; Ding, Ai-Li; Luo, Wei-Gen; Qiu, Ping-Sun, AMF-2, 1998 |
| Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging Cho, MG; Paik, Kyung-Wook; Lee, HyuckMo; Booh, SW; Kim, TG, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.1, pp.35 - 40, 2006-01 |
| Interfacial reaction between aluminum metal and boron-doped polysilicon in a planar type antifuse device Baek, JT; Park, HH; Ahn, Byung Tae; Jun, CH; Kim, YT; Song, YH; Kim, J, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.37, no.5A, pp.2451 - 2454, 1998-05 |
| Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate Yoon, SW; Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.40, no.3, pp.327 - 332, 1999 |
| Interfacial reaction between Sn-Ag-based solder alloys and substrates Choi, WK; Lee, HyuckMo, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, no.S, pp.344 - 2, 1999-07 |
| Interfacial reaction in the sputter-deposited SiO2/Ti0.1W0.9 antifuse system Baek, Jong Tae; Park, Hyung-Ho; Cho, Kyung-Ik; Yoo, Hyung Joun; Kang, Sang-Won; Ahn, Byung Tae, JOURNAL OF APPLIED PHYSICS, v.78, no.12, pp.7074 - 7079, 1995-12 |
| Interfacial reaction of Sn-3.5wt%Ag solder alloy with a variance of Ni layer thickness Choi, YG; Lee, HyuckMo, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.37, no.11, pp.1416 - 1421, 1999-11 |
| Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM Jee, YK; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.10, pp.2286 - 2291, 2010-10 |
| Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2242 - 2250, 2009-11 |
| Interfacial reactions between CuxNiy alloy underbump metallurgy and Sn-Ag-zCu solders Han, H; Sohn, YC; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.5, pp.578 - 586, 2007-05 |
| Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition Kang, SK; Leonard, D; Shih, DY; Gignac, L; Henderson, DW; Cho, S; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.3, pp.479 - 485, 2006-03 |
| Interfacial stability of ultrathin films of magnetite Fe3O4 (111) on Al2O3(001) grown by ozone-assisted molecular-beam epitaxy Hong, Hawoong; Kim, Jongjin; Fang, Xinyue; Hong, Daniel Seungbum; Chiang, T-C, APPLIED PHYSICS LETTERS, v.110, no.2, 2017-01 |
| INTERFACIAL STAGES OF THE ZNTE/GAAS STRAINED HETEROSTRUCTURES GROWN BY TEMPERATURE-GRADIENT VAPOR TRANSPORT DEPOSITION AT LOW-TEMPERATURE KIM, TW; PARK, HL; Lee, JeongYong, APPLIED PHYSICS LETTERS, v.64, no.19, pp.2526 - 2528, 1994-05 |
| Interfacial Trap Density-of-States in Pentacene- and ZnO-Based Thin-Film Transistors Measured via Novel Photo-excited Charge-Collection Spectroscopy Lee, Kimoon; Oh, Min Suk; Mun, Sung-jin; Lee, Kwang H.; Ha, Tae Woo; Kim, Jae Hoon; Park, Sang-Hee Ko; et al, ADVANCED MATERIALS, v.22, no.30, pp.3260 - 3260, 2010-08 |
Interference of Solvatochromic Twist in Amyloid Nanostructure for Light-Driven Biocatalysis Son, Giyeong; Kim, Jinhyun; Park, Chan Beum, ACS APPLIED ENERGY MATERIALS, v.3, no.1, pp.1215 - 1221, 2020-01 |
| Intergation of platinum bottom electrode on poly-Si for ferroelectrics thin films Kim, Ho Gi, APPLIED SURFACE SCIENCE, 1999-01 |
| Intergranular amorphous films and dislocations-promoted grain growth in SrTiO3 Chung, Sung-Yoon; Kang, Suk-Joong L, ACTA MATERIALIA, v.51, no.8, pp.2345 - 2354, 2003 |
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