Browse "MS-Journal Papers(저널논문)" by Type Article
Showing results 1981 to 2000 of 7245
| EFFECTS OF CATION DISTRIBUTION ON SUPEREXCHANGE INTERACTION IN COBALT FERRITES NA, JG; Lee, Taek Dong; PARK, SJ; TANG, YJ; LUO, HL, IEEE TRANSACTIONS ON MAGNETICS, v.31, no.6, pp.3970 - 3972, 1995-11 |
| Effects of Centerline Segregation of Cr Carbides and Non-Metallic Inclusions on the Pitting Corrosion of Fe-13Cr-0.3C Stainless Steel Produced by Continuous Casting and Strip Casting Jung, Ki Min; Oh, Kkoch-Nim; Nam, Do-Hwan; Ahn, Soohoon; Oh, Se-Kwon; Kwon, HyukSang, CORROSION, v.73, no.8, pp.979 - 987, 2017-08 |
| Effects of chemical oxidations on the fracture toughness of leadframe/EMC interfaces Lee, HY; Yu, Jin, METALS AND MATERIALS-KOREA, v.5, no.5, pp.471 - 476, 1999-10 |
| Effects of Cl doping on the structural and electrochemical properties of high voltage LiMn1.5Ni0.5O4 cathode materials for Li-ion batteries Kim, Won Keun; Han, Dong Wook; Ryu, Won Hee; Lim, Sung Jin; Eom, Ji-Yong; Kwon, Hyuk-Sang, JOURNAL OF ALLOYS AND COMPOUNDS, v.592, pp.48 - 52, 2014-04 |
| Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development Lee, Jung-Sub; Chu, Kun-Mo; Patzelt, Rainer; Manessis, Dionysios; Ostmann, Andreas; Jeon, DukYoung, MICROELECTRONIC ENGINEERING, v.85, no.7, pp.1577 - 1583, 2008-07 |
| Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM Kim, Dong Hoon; Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.1, pp.39 - 45, 2009-01 |
| EFFECTS OF COMPOSITION AND CARBIDE PRECIPITATION ON TEMPER EMBRITTLEMENT OF 2.25 CR-1 MO STEEL .1. EFFECTS OF P AND SN Yu, Jin; MCMAHON, CJ, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.11, no.2, pp.277 - 289, 1980 |
| EFFECTS OF COMPOSITION AND CARBIDE PRECIPITATION ON TEMPER EMBRITTLEMENT OF 2.25 CR-1 MO STEEL .2. EFFECTS OF MN AND SI Yu, Jin; MCMAHON, CJ, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.11, no.2, pp.291 - 300, 1980 |
| Effects of compositional and structural change on the corrosion behaviour of nitrogen implanted Zircaloy-4 Lee, SJ; Kwon, Hyuk-Sang; Kim, W; Choi, BH, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.263, no.1, pp.23 - 31, 1999-04 |
| Effects of Conductive Particles on the Electrical Stability and Reliability of Anisotropic Conductive Film Chip-On-Board Interconnections Chung, Chang-Kyu; Sim, Gidong; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.3, pp.359 - 366, 2012-03 |
| Effects of core/shell volumetric ratio on the dielectric-temperature behavior of BaTiO3 Jeon, Sang-chae; Yoon, Byung-kwon; Kim, Kwan-Hyeong; Kang, Suk-Joong L, JOURNAL OF ADVANCED CERAMICS, v.3, no.1, pp.76 - 82, 2014-03 |
| Effects of CoZrNb surface morphology on magnetic properties and grain isolation of CoCrPtO perpendicular recording media Hong, DH; Park, SH; Lee, Taek Dong, IEEE TRANSACTIONS ON MAGNETICS, v.41, pp.3148 - 3150, 2005-10 |
| Effects of Cr/Al underlayer on magnetic properties and crystallography in CoCrPtTa/Cr/Al thin films Chang, HS; Shin, KH; Lee, Taek Dong; Park, Joong Keun, IEEE TRANSACTIONS ON MAGNETICS, v.32, no.5, pp.3617 - 3619, 1996-09 |
| Effects of Cr2N on the pitting corrosion of high nitrogen stainless steels Ha, H; Kwon, Hyuk-Sang, ELECTROCHIMICA ACTA, v.52, pp.2175 - 2180, 2007-01 |
| Effects of CrMo spacer layer on thermal stability and magnetic properties in an antiferromagnetically coupled medium Lee, Taek Dong, JOURNAL OF APPLIED PHYSICS, v.93, no.10, pp.7771 - 7773, 2003-05 |
| Effects of Cu addition on the creep rupture properties of a 12% Cr steel Ku, BS; Yu, Jin, SCRIPTA MATERIALIA, v.45, no.2, pp.205 - 211, 2001-07 |
| Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability Gam, SA; Kim, HJ; Cho, JS; Park, YJ; Kim,SH; Moon, JT; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.2048 - 2055, 2006-11 |
| Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy Jeon, YD; Paik, Kyung-Wook; Ostmann, A; Reichl, H, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.80 - 90, 2005-01 |
| Effects of Cu on the passive film stability of Fe-20Cr-xCu (x=0, 2,4 wt.%) alloys in H2SO4 solution Oh, Kkoch-Nim; Toor, Ihsan-ul-Haq; Ahn, Soo-Hoon; Kwon, Hyuk-Sang, ELECTROCHIMICA ACTA, v.88, pp.170 - 176, 2013-01 |
| Effects of Cu substrate morphology and phase control on electrochemical performance of Sn-Ni alloys for Li-ion battery Shin, Na-Ry; Kang, Yong-Mook; Song, Min-Sang; Kim, Dong-Yung; Kwon, Hyuk-Sang, JOURNAL OF POWER SOURCES, v.186, no.1, pp.201 - 205, 2009-01 |
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- 179 1980 - 1989