Browse "MS-Journal Papers(저널논문)" by Type Article
Showing results 1201 to 1220 of 7243
| CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - Interfacial reaction and bump shear strength Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Schreiber, T; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.1, pp.245 - 254, 2003-03 |
| CREEP CAVITATION IN A NICR STEEL CHO, HC; Yu, Jin; PARK, IS, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.23, no.1, pp.201 - 210, 1992-01 |
| Creep crack growth in brittle materials Jeon, JY; Lee, YS; Yu, Jin, INTERNATIONAL JOURNAL OF FRACTURE, v.101, no.3, pp.203 - 214, 2000-02 |
| Creep deformation behavior of mechanically alloyed Al-10Ti-2Si alloy Choi, CJ; Park, Joong Keun; Park, WW, SCRIPTA MATERIALIA, v.36, no.7, pp.769 - 774, 1997-04 |
| Creep deformation of lead-free Sn-3.5Ag-Bi solders Shin, SW; Yu, Jin, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.42, no.3, pp.1368 - 1374, 2003-03 |
| Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints Shin, SW; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.2, pp.188 - 195, 2005-02 |
| Creep Properties of Directionally Solidified TiAl Alloys Using a Seeding Technique 위당문, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.40, no.1, pp.39 - 48, 2002-01 |
| Creep rupture of lead-free Sn-3.5Ag-Cu solders Joo, DK; Yu, Jin; Shin, SW, JOURNAL OF ELECTRONIC MATERIALS, v.32, no.6, pp.541 - 547, 2003-06 |
| CREEP-RUPTURE BY DIFFUSIVE GROWTH OF CONTINUALLY NUCLEATING CAVITIES Yu, Jin; Chung, JO, SCRIPTA METALLURGICA, v.22, no.1, pp.27 - 30, 1988-01 |
| CREEP-RUPTURE BY DIFFUSIVE GROWTH OF RANDOMLY DISTRIBUTED CAVITIES .1. INSTANTANEOUS CAVITY NUCLEATION Yu, Jin; CHUNG, JO, ACTA METALLURGICA ET MATERIALIA, v.38, no.8, pp.1423 - 1434, 1990-08 |
| CREEP-RUPTURE BY DIFFUSIVE GROWTH OF RANDOMLY DISTRIBUTED CAVITIES .2. CONTINUAL CAVITY NUCLEATION Yu, Jin; Chung, JO, ACTA METALLURGICA ET MATERIALIA, v.38, no.8, pp.1435 - 1443, 1990-08 |
| CREEP-RUPTURE IN A NICKEL-BASED SUPERALLOY KIM, TK; Yu, Jin; JEON, JY, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.23, no.9, pp.2581 - 2587, 1992-09 |
| CREEP-RUPTURE IN A NICR STEEL CHO, HC; Yu, Jin; PARK, IS, SCRIPTA METALLURGICA ET MATERIALIA, v.24, no.6, pp.1015 - 1020, 1990-06 |
| CRITICAL CRACKING POTENTIALS OF 26CR-1 MO FERRITIC STAINLESS-STEELS IN BOILING 42-PERCENT LICL SOLUTION Hehemann, RF; Troiano, AR; Kwon, Hyuk-Sang, CORROSION, v.48, no.10, pp.838 - 845, 1992-10 |
| Critical grain size for abnormal grain growth of BaTiO3 in air Yang, Dong-Yeol; Choi, Si-Young; Kang, Suk-Joong L, JOURNAL OF THE CERAMIC SOCIETY OF JAPAN, v.114, pp.970 - 973, 2006-11 |
| Cross-aligned carbon nanofibrous network for efficient and outstanding high-rate Li storage capability Cheong, Jun Young; Hwang, Wontae; Lee, Jiyoung; Kim, Il-Doo, ELECTROCHIMICA ACTA, v.387, 2021-08 |
| Crosslinked monosulfonated poly(arylene ether) using cyclodimerization of trifluorovinyl ether groups for fuel cell applications Kim, Byoung Gak; Kim, Hyoung-Juhn; Jang, Jong Hyun; Cho, EunAe; Henkensmeier, Dirk; Kim, Soo-Kil; Oh, In-Hwan; et al, POLYMER INTERNATIONAL, v.60, no.4, pp.685 - 691, 2011-04 |
| Crucial microstructural feature to determine the impact toughness of intercritically annealed medium-Mn steel with triplex-phase microstructure Kim, Min Tae; Park, Tak Min; Baik, Kyeong-Ho; Choi, Woo Seok; Choi, Pyuck-Pa; Han, Jeongho, ACTA MATERIALIA, v.164, pp.122 - 134, 2019-02 |
| Crystal growth direction-controlled antimony selenide thin film absorbers produced using an electrochemical approach and intermediate thermal treatment Kwon, Yong Hun; Kim, Young Been; Jeong, Myoungho; Do, Hyun Woo; Cho, Hyung Koun; Lee, Jeong Yong, SOLAR ENERGY MATERIALS AND SOLAR CELLS, v.172, pp.11 - 17, 2017-12 |
| Crystal orientation of beta-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.25, no.10, pp.1950 - 1957, 2010-10 |
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