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Results 31-40 of 187 (Search time: 0.005 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Direct Hydrogen generation from alkali metal hydride solution and water Kwon, Hyuk-Sang; Eom, Kwang Sup; Cho, Keun Woo, EEWS 2008, EEWS, 2008 | |
| Toughness of steel plates for offshore structures manufactured by TMCP Kim, SH; Jang, WK; Lee, KH; Hong, Soon-Hyung, 18th 2008 International Offshore and Polar Engineering Conference, ISOPE 2008, pp.194 - 199, 2008-07-06 | |
| 다이아몬드/실리콘카바이드 복합재료의 제조공정 및 기계적 특성 Hong, Soon-Hyung, Fall Meeting of The Korean Society for Composite Materials, pp.275 - 275, 2008-11-07 | |
| SAB(Surface Activated Bonding)처리된 Cu계 클래드 메탈의 기계적 특성과 계면특성 분석 Hong, Soon-Hyung, Fall Conference of the Korean Institute of Metals and Materials, pp.62 - 62, 2008-10-23 | |
| Flexible pentacene organic thin film transistors using sol-gel hybrid polymer gate dielectrics Choi, CG; Kwak, SY; Bae, Byeong-Soo, 2008 SID International Symposium, pp.1239 - 1242, 2008-05-20 | |
| Perpendicular magnetization of FePt : C thin film on a new underlayer of Pt/MgO(p) thin film Park, Joong Keun; Lee, Wan Hee; Lee, Seung Hyun, 53rd Annual Conference on Magnetism and Magnetic Materials, Magnetism and Magnetic Materials, 2008-11 | |
| Effect of carbon mixing on the perpendicular anisotropy of FePt thin film Park, Joong Keun, International Magnetics Conference 2008, International Magnetics Conference, 2008-05 | |
| Search for new red phosphors under NUV/blue excitation - the stimulating future for solid state lighting Sivakumar, V; Jeon, Duk Young, 8th International Meeting on Information Display - International Display Manufacturing Conference 2008 and Asia Display 2008, IMID/IDMC/ASIA DISPLAY 2008, pp.1350 - 1352, 2008-10-13 | |
| 플렉스 기판 안에 웨이퍼 레벨 패키지 기술을 적용한 초박형 칩을 내장한 패키지 백경욱; 석경림; 손호영; 정창규; 김중도; 이진우, 한국마이크로전자 및 패키징학회 2008년도 추계학술대회, 한국마이크로전자 및 패키징학회, 2008 | |
| Multi-walled carbon nanotube/nanocrystalline copper nanocomposite film as an interconnect material Yoo, JJ; Song, JY; Yu, Jin; Lyeo, HK; Lee, S; Hahn, JH, 2008 58th Electronic Components and Technology Conference, ECTC, pp.1282 - 1286, 2008-05-27 |
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