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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Effects of Substrate Morphology on Adhesion and Pore Structure of Cu foam Prepared by Electrodeposition Kim, Ryung Hee; Han, Dong Wook; Nam, Do Hwan; Kim, Jeong Han; Kwon Hyuk-Sang, 2009 International Conference on Nano Science and Nano Technology, Gwangju-Jeonnam Nano Science and Technology Union, 2009-11 | |
| Preparation of 3-dimensionaaly interconnected copper foam with high strength by electrodeposition Nam, Do Hwan; Kim, Ryoung Hee; Kim, Jeong Han; Kwon Hyuk-Sang, The 60th Annual Meeting of the International Society of Electrochemistry, International Society of Electrochemistry, 2009-08 |
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