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Results 1-10 of 20 (Search time: 0.004 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Development of low temperature bonding using in-based solders

Choi, WK; Yu, D; Lee, C; Yan, L; Yu, A; Yoon, SW; Lau, JH; Cho, MG; Jo, YH; Lee, Hyuck Mo, 2008 58th Electronic Components and Technology Conference, ECTC, pp.1294 - 1299, 2008-05-27

2
Proceedings of the?58th Electronic Components & Technology Conference (ECTC)

Lee, Hyuck Mo, 58th Electronic Components and Technology Conference, IEEE, 2008-05

3
Phase diagram of the Ag-Pd bimetallic nanocluster: Molecular Dynamic simulation

Lee, Hyuck Mo, 37th CALPHAD, 2008-06-15

4
흑연에 지지된 나노 입자의 확산 및 회전거동 분석

Lee, Hyuck Mo, 대한금속재료학회 학술발표회, 2008-04-25

5
Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders

Kang, SK; Cho, MG; Shih, DY; Seo, SK; Lee, Hyuck Mo, 2008 58th Electronic Components and Technology Conference, ECTC, pp.478 - 484, 2008-05-27

6
An investication of Microstructure and Mechanical Properties of Pb-Free Solders as a Function Alloy composition and Cooling Rate

Lee, Hyuck Mo, 137th TMS Annual Meeting, 2008-03-12

7
Undercooling of Pb-Free Solders on Various UMBs

Lee, Hyuck Mo, 137th TMS Annual Meeting, 2008-03-11

8
Effect on Co Addition on Undercooling,Microstuctures and Mircohardness of Sn-3.5Ag Solder and Interfacial Reations with Ni-P UBM

Lee, Hyuck Mo, 137th TMS Annual Meeting, 2008-03-11

9
Is the Cu-xZn Alloy Under Bump Metallurgy an Alternative to the Cu Substrate: Its Thermodynamic Interpretation

Lee, Hyuck Mo, 37th CALPHAD, 2008-06-17

10
Density functional study on CO oxidation of doped rutile tio2(110)

Lee, Hyuck Mo, The 14th International Congress on Catalysis (ICC-2008), 2008-07-13

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