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Results 201-210 of 222 (Search time: 0.013 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A study on epoxy/BaTiO3 embedded capacitor pastes for organic substrates Jang, KW; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.1504 - 1509, IEEE, 2006-05-30 | |
| Degradation mechanism and reliability of flip chip interconnects using anisotropic conductive adhesives for high current density packaging applications Yim, MJ; Kim, HJ; Chung, CK; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.338 - 343, IEEE, 2006-05-30 | |
| Curing and bonding behaviors of Anisotropic Conductive Films (ACFs) by ultrasonic vibration for flip chip interconnection Lee, KW; Kim, HJ; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.918 - 923, IEEE, 2006-05-30 | |
| Dielectric properties of alumina ceramics in the microwave frequency at high temperature Park M.K.; Kim H.N.; Baek S.S.; Kang E.S.; Baek Y.K.; Kim, Do Kyung, IUMRS International Conference in Asia 2006, IUMRS-ICA 2006, pp.743 - 746, 123, 2006-09-10 | |
| Large area synthesis of 1-D ZnO nanostructure arrays on Zn substrate via solvothermal process Park J.H.; Choi H.G.; Kim J.H.; Kim, Do Kyung, IUMRS International Conference in Asia 2006, IUMRS-ICA 2006, pp.1169 - 1172, 123, 2006-09-10 | |
| Micromagnetic study on the threshold current density for continuous domain wall motion Kim W.J.; Seo S.M.; Lee, Taek Dong; Lee K.J., 2006 IEEE Nanotechnology Materials and Devices Conference, NMDC, pp.396 - 398, 123, 2006-10-22 | |
| Effect of conductive particle properties on the reliability of anisotropic conductive film for Chip-On-Glass (COG) applications Yim, MJ; Chung, CK; Paik, Kyung-Wook, IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp.38 - 0, 123, 2006-03-15 | |
| Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30 | |
| Study of deformation texture of equal-channel angular pressed CP-titanium Liu, SM; Chon, SH; Park, Joong Keun, 5th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2006, pp.3466 - 3471, 123, 2006-07-04 | |
| Substructures and fatigue crack growth in HIPing and semi-liquid die casting A356 alloys Han, SW; Lee, Hyuck Mo, 5th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2006, pp.469 - 474, 123, 2006-07-04 |
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