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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Study of drop-performance improved lead-free solder by PCB pad finish Lee, YW; Lee, JH; Moon, JT; Park, YS; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.668 - 672, 2009-12-09 | |
| Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage Shin, JW; Song, MS; Park, YS; Kwon, YM; Moon, JT; Cho, JS; Yoo, KA; Byun, KY; Joh, CH; Do, EH; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.942 - 946, 2009-12-09 | |
| Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability Park, YS; Kwon, YM; Moon, JT; Lee, YW; Lee, JH; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.321 - 324, 2009-12-09 |
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